SMD Chip Inductors and Beads

Category:

Description

SMD Chip Inductors and Beads

From high power to high frequency applications AEM™s complete line of chip inductors and beads are an excellent solution for EMI signal filtering.

Multilayer Ferrite Chip Beads

Features

  • Monolithic structure for closed magnetic path and high reliability
  • Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, 0805/2012, and 1206/3216
  • A complete set of ferrite and electrode materials providing a wide range of electrical properties
  • Superior termination bonding strength
  • Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes
  • RoHS compliant when -T option is specified

Multilayer Ferrite Chip Beads (High Speed)

Features

  • Monolithic structure for closed magnetic path and high reliability
  • Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, 0805/2012, and 1206/3216
  • Superior termination bonding strength
  • Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes
  • RoHS compliant when -T option is specified

Multilayer Ferrite Power Beads

Features

  • Monolithic structure for closed magnetic path and high reliability
  • Maximum permissible currents up to 4A
  • Standard EIA/EIAJ chip sizes such as 0603/1608, 0805/2012, and 1206/3216
  • Superior termination bonding strength
  • Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes
  • RoHS compliant when -T option is specified

Multilayer Ceramic Inductors

Features

  • Monolithic structure with high reliability
  • Standard EIA/EIAJ chip sizes such as 0402/1005 and 0603/1608
  • High quality ceramic material and unique manufacturing processes providing high Q at high frequencies and high self-resonant frequencies
  • Superior termination bonding strength
  • Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes